STATS ChipPAC Delivers Industry Leading Ultra Thin Package-on-Package Solutions With eWLB Packaging

SINGAPORE -- 20 AUGUST 2013, UNITED STATES -- (Marketwired) -- 08/19/13 -- ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced a new milestone in reducing Package-on-Package ...